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Interfacial Energy for Oraganosilane tailored Copper-Silica Interface

Delamination Nanomechanics and Energy Partition into Adhesion and Plasticity

Erschienen am 17.11.2010, 1. Auflage 2010
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Bibliografische Daten
ISBN/EAN: 9783843373906
Sprache: Englisch
Umfang: 124 S.
Format (T/L/B): 0.8 x 22 x 15 cm
Einband: kartoniertes Buch

Beschreibung

The partitioning of interface fracture energy into bond breaking energy and plastic energy in ductile layer(s) constituting the interface is a central problem in fracture mechanics. A new approach to partition the fracture energy of a metal-ceramic interface into work of adhesion and plasticity is introduced, unveiling the nanomechanics of interfacial deformation and fracture. The crack path uncertainties are obviated by constraining fracture to occur in an interfacial molecular layer through fissure of a single bond type whose strength is varied by adjusting the chemical environment. This approach is adaptable for studying interfacial fracture and related phenomena in diverse materials systems in different thermochemical environments.

Autorenportrait

Ashutosh Jain attended Indian Institute of Technology, Bombay for undergraduate studies and has MS in Materials Science from University of Virginia in collaboration with Los Alamos National Lab. He received his PhD from Rensselaer Polytechnic Institute at Troy, NY in 2009, and is currently employed at Intel Corporation.